| 李超群.复合电镀新工艺金刚石钻头[J].地质与勘探,1995,(1): |
| 复合电镀新工艺金刚石钻头 |
| A New Compound Electroplate Technology of Diamond Bit |
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| DOI： |
| 中文关键词: 复合电镀，金刚石微粉，比例，厚度 |
| 英文关键词: compound electroplate,diamond micro-powder,ratio,thickness, |
| 基金项目: |
| 李超群 |
| 湖南省金刚石制品研究所 |
| 摘要点击次数: 2135 |
| 全文下载次数: 1351 |
| 中文摘要: |
| 在普通钻头镀液中加入１０ｇ／ｌ金刚石微粉，得到镍－钴－金刚石微粉复合镀层，可提高钻头胎体的耐磨性；将２种品级、３种粒度金刚石按一定比例混合使用，扩大了钻头的适用范围，提高了钻头的自锐性；通过改变内、外径和底唇面胎体孕镶层厚度的比例，做到镀层基本同步消耗。 |
| 英文摘要: |
| Diamond micro- powder of 10g/l is put in plating liquid for diamond bits,a compound coat of Ni-Co-diamond micro-powder-plating is obtained,by which the wearability of the bit is strengthened.A certain amount of Diamond consisted of 2 grades and 3 particle sizes in a proportion is used.The bits can be used in a wider area,and their sharpness is increased.Through changing the inner and outer diameters and the thick ratio of base lip plane to plating coat,it can be realized to use up the plating coat syn-chronously. |
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